Part Details for TMS3135JC by Texas Instruments
Overview of TMS3135JC by Texas Instruments
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for TMS3135JC
TMS3135JC CAD Models
TMS3135JC Part Data Attributes:
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TMS3135JC
Texas Instruments
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TMS3135JC
Texas Instruments
IC,SHIFT REGISTER,MOS,DIP,24PIN,CERAMIC
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | DIP, DIP24,.6 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Count Direction | RIGHT | |
| Family | 3135 | |
| JESD-30 Code | R-XDIP-T24 | |
| Logic IC Type | SERIAL IN SERIAL OUT | |
| Max Frequency@Nom-Sup | 1500000 Hz | |
| Number of Bits | 80 | |
| Number of Functions | 9 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Output Polarity | TRUE | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Propagation Delay (tpd) | 550 ns | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | MOS | |
| Temperature Grade | OTHER | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Trigger Type | NEGATIVE EDGE |