Part Details for TMP92CZ26AXBG by Toshiba America Electronic Components
Overview of TMP92CZ26AXBG by Toshiba America Electronic Components
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Price & Stock for TMP92CZ26AXBG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Onlinecomponents.com | MCU 32-bit TLCS-900 CISC 288KB ROM 3.3V 228-Pin BGA RoHS: Compliant |
11 In Stock |
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$42.8600 | Buy Now |
Part Details for TMP92CZ26AXBG
TMP92CZ26AXBG CAD Models
TMP92CZ26AXBG Part Data Attributes
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TMP92CZ26AXBG
Toshiba America Electronic Components
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Datasheet
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TMP92CZ26AXBG
Toshiba America Electronic Components
IC 32-BIT, FLASH, 80 MHz, MICROCONTROLLER, PBGA228, 15 X 15 MM, 0.80 MM PITCH, PLASTIC, FBGA-228, Microcontroller
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | BGA | |
| Package Description | 15 X 15 MM, 0.80 MM PITCH, PLASTIC, FBGA-228 | |
| Pin Count | 228 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Toshiba | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Clock Frequency-Max | 10 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B228 | |
| Length | 15 mm | |
| Number of I/O Lines | 136 | |
| Number of Terminals | 228 | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.4 mm | |
| Speed | 80 MHz | |
| Supply Voltage-Max | 1.6 V | |
| Supply Voltage-Min | 1.4 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |