Part Details for TMP92CF29AFG by Toshiba America Electronic Components
Overview of TMP92CF29AFG by Toshiba America Electronic Components
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for TMP92CF29AFG
TMP92CF29AFG CAD Models
TMP92CF29AFG Part Data Attributes
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TMP92CF29AFG
Toshiba America Electronic Components
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Datasheet
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TMP92CF29AFG
Toshiba America Electronic Components
IC 32-BIT, FLASH, 80 MHz, MICROCONTROLLER, PQFP176, 20 X 20 MM, 0.40 MM PITCH, PLASTIC, LQFP-176, Microcontroller
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| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | QFP | |
| Package Description | 20 X 20 MM, 0.40 MM PITCH, PLASTIC, LQFP-176 | |
| Pin Count | 176 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 10 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 8 | |
| JESD-30 Code | S-PQFP-G176 | |
| Length | 20 mm | |
| Number of I/O Lines | 72 | |
| Number of Terminals | 176 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.85 mm | |
| Speed | 80 MHz | |
| Supply Voltage-Max | 1.6 V | |
| Supply Voltage-Min | 1.4 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |