Datasheets
TMP47C858F by: Toshiba America Electronic Components

IC 4-BIT, MROM, 0.96 MHz, MICROCONTROLLER, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, QFP-100, Microcontroller

Part Details for TMP47C858F by Toshiba America Electronic Components

Results Overview of TMP47C858F by Toshiba America Electronic Components

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

TMP47C858F Information

TMP47C858F by Toshiba America Electronic Components is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for TMP47C858F

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TMP47C858F Part Data Attributes

TMP47C858F Toshiba America Electronic Components
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TMP47C858F Toshiba America Electronic Components IC 4-BIT, MROM, 0.96 MHz, MICROCONTROLLER, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, QFP-100, Microcontroller
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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code QFP
Package Description QFP, QFP100,.7X.9
Pin Count 100
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Has ADC NO
Address Bus Width
Bit Size 4
Boundary Scan NO
CPU Family TLCS-470
Clock Frequency-Max 0.96 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code R-PQFP-G100
Length 20 mm
Number of I/O Lines 35
Number of Terminals 100
On Chip Program ROM Width 8
Operating Temperature-Max 60 °C
Operating Temperature-Min -30 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP100,.7X.9
Package Shape RECTANGULAR
Package Style FLATPACK
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
RAM (bytes) 256
ROM (words) 8192
ROM Programmability MROM
Seated Height-Max 3.05 mm
Speed 0.96 MHz
Supply Current-Max 5 mA
Supply Voltage-Max 6 V
Supply Voltage-Min 5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER