Part Details for TMM5712 by STMicroelectronics
Overview of TMM5712 by STMicroelectronics
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
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Part Details for TMM5712
TMM5712 CAD Models
TMM5712 Part Data Attributes
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TMM5712
STMicroelectronics
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TMM5712
STMicroelectronics
SILICON, VHF-UHF BAND, MIXER DIODE, GLASS, MINIMELF-2
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | MELF | |
| Package Description | O-LELF-R2 | |
| Pin Count | 2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.60 | |
| Additional Feature | MATCHED BATCH AVAILABLE | |
| Case Connection | ISOLATED | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 1.2 pF | |
| Diode Element Material | SILICON | |
| Diode Type | MIXER DIODE | |
| Forward Voltage-Max (VF) | 1 V | |
| Frequency Band | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY | |
| JESD-30 Code | O-LELF-R2 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 200 °C | |
| Operating Temperature-Min | -65 °C | |
| Output Current-Max | 0.035 A | |
| Package Body Material | GLASS | |
| Package Shape | ROUND | |
| Package Style | LONG FORM | |
| Power Dissipation-Max | 0.43 W | |
| Qualification Status | Not Qualified | |
| Rep Pk Reverse Voltage-Max | 20 V | |
| Surface Mount | YES | |
| Technology | SCHOTTKY | |
| Terminal Form | WRAP AROUND | |
| Terminal Position | END |