Part Details for TMM314APL-3 by Toshiba America Electronic Components
Overview of TMM314APL-3 by Toshiba America Electronic Components
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for TMM314APL-3
TMM314APL-3 CAD Models
TMM314APL-3 Part Data Attributes
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TMM314APL-3
Toshiba America Electronic Components
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Datasheet
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TMM314APL-3
Toshiba America Electronic Components
IC,SRAM,1KX4,MOS,DIP,18PIN,PLASTIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Package Description | DIP, DIP18,.3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 300 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PDIP-T18 | |
JESD-609 Code | e0 | |
Memory Density | 4096 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 4 | |
Number of Terminals | 18 | |
Number of Words | 1024 words | |
Number of Words Code | 1000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1KX4 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP18,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | MOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |