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Optoelectronics / Optocoupler / TLP3052(S)
Datasheets
TLP3052(S) by: Toshiba America Electronic Components

Optocoupler - Trigger Device Output, 1 CHANNEL TRIAC OUTPUT OPTOCOUPLER, PLASTIC, 11-7A9, DIP-6

Part Details for TLP3052(S) by Toshiba America Electronic Components

Results Overview of TLP3052(S) by Toshiba America Electronic Components

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Applications Space Technology Aerospace and Defense Transportation and Logistics Renewable Energy Automotive Robotics and Drones

TLP3052(S) Information

TLP3052(S) by Toshiba America Electronic Components is an Optocoupler.
Optocoupler are under the broader part category of Optoelectronics.

Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.

Price & Stock for TLP3052(S)

Part # Distributor Description Stock Price Buy
Quest Components 1 CHANNEL TRIAC OUTPUT OPTOCOUPLER 3345
  • 1 $3.7500
  • 433 $2.0625
  • 971 $1.8750
$1.8750 / $3.7500 Buy Now

Part Details for TLP3052(S)

TLP3052(S) CAD Models

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TLP3052(S) Part Data Attributes

Parametric Data
TLP3052(S) Toshiba America Electronic Components
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TLP3052(S) Toshiba America Electronic Components Optocoupler - Trigger Device Output, 1 CHANNEL TRIAC OUTPUT OPTOCOUPLER, PLASTIC, 11-7A9, DIP-6
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Part Life Cycle Code End Of Life
Ihs Manufacturer TOSHIBA CORP
Package Description PLASTIC, 11-7A9, DIP-6
Reach Compliance Code unknown
HTS Code 8541.40.80.00
Additional Feature UL RECOGNIZED
Configuration SINGLE
Forward Current-Max 0.025 A
Input Trigger Current-Nom 5 mA
Isolation Voltage-Max 5000 V
Number of Elements 1
On-State Current-Max 0.1 A
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Optoelectronic Device Type TRIAC OUTPUT OPTOCOUPLER
Peak Off-state Voltage-Min 600 V

TLP3052(S) Related Parts

TLP3052(S) Frequently Asked Questions (FAQ)

  • Toshiba recommends a PCB layout with a solid ground plane, short traces, and minimal impedance to ensure high-speed signal integrity and reduce electromagnetic interference (EMI). A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.

  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and management practices. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, derating the device's operating conditions and using thermal monitoring and protection circuits can help prevent overheating.

  • When using the TLP3052(S) in a system with multiple voltage domains, it is essential to ensure that the device is powered from a stable and regulated voltage source. Additionally, level shifting or voltage translation may be required to ensure compatibility between different voltage domains. It is also important to consider the impact of voltage domain switching on the device's operation and ensure that the device is properly reset or initialized after a power cycle.

  • To troubleshoot issues with the TLP3052(S), start by verifying the device's power supply and clock signals. Check for proper voltage levels, clock frequency, and signal integrity. Use oscilloscopes or logic analyzers to monitor the device's input and output signals. Consult the datasheet and application notes for guidance on troubleshooting common issues, such as signal skew, jitter, or data corruption.

  • The TLP3052(S) has built-in electrostatic discharge (ESD) protection circuits to prevent damage from static electricity. However, it is still essential to follow proper ESD handling and storage procedures to prevent damage. Additionally, latch-up prevention measures, such as using a latch-up immune design and following proper power-up and power-down sequences, can help prevent latch-up conditions.