Part Details for THMY25N11C70 by Toshiba America Electronic Components
Overview of THMY25N11C70 by Toshiba America Electronic Components
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Part Details for THMY25N11C70
THMY25N11C70 CAD Models
THMY25N11C70 Part Data Attributes
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THMY25N11C70
Toshiba America Electronic Components
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Datasheet
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THMY25N11C70
Toshiba America Electronic Components
IC 32M X 8 SYNCHRONOUS DRAM MODULE, 5.4 ns, DMA168, DIMM-168, Dynamic RAM
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | DIMM | |
Package Description | DIMM, DIMM168 | |
Pin Count | 168 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.24 | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 5.4 ns | |
Additional Feature | AUTO/SELF REFRESH; WD-MAX | |
Clock Frequency-Max (fCLK) | 142 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-XDMA-N168 | |
Length | 133.35 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | SYNCHRONOUS DRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 168 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Equivalence Code | DIMM168 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Seated Height-Max | 34.98 mm | |
Self Refresh | YES | |
Standby Current-Max | 0.008 A | |
Supply Current-Max | 1.36 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 2.8 mm |