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Overview of THGBM4G9D8GBAII by Toshiba America Electronic Components
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for THGBM4G9D8GBAII by Toshiba America Electronic Components
Part Data Attributes for THGBM4G9D8GBAII by Toshiba America Electronic Components
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Part Life Cycle Code
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Active
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Ihs Manufacturer
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TOSHIBA CORP
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Package Description
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BGA,
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Reach Compliance Code
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unknown
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HTS Code
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8542.31.00.01
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JESD-30 Code
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R-PBGA-B169
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Number of Terminals
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169
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-25 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY
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Supply Voltage-Max
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3.6 V
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Supply Voltage-Min
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2.7 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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OTHER
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Terminal Form
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BALL
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Terminal Position
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BOTTOM
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uPs/uCs/Peripheral ICs Type
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SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
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