Part Details for TH58BYG3S0HBAI4 by Toshiba America Electronic Components
Overview of TH58BYG3S0HBAI4 by Toshiba America Electronic Components
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for TH58BYG3S0HBAI4
TH58BYG3S0HBAI4 CAD Models
TH58BYG3S0HBAI4 Part Data Attributes
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TH58BYG3S0HBAI4
Toshiba America Electronic Components
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Datasheet
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TH58BYG3S0HBAI4
Toshiba America Electronic Components
IC FLASH 1.8V PROM, Programmable ROM
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | BGA | |
Package Description | VFBGA, | |
Pin Count | 63 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 25 ns | |
JESD-30 Code | R-PBGA-B63 | |
Length | 11 mm | |
Memory Density | 8589934592 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 63 | |
Number of Words | 1073741824 words | |
Number of Words Code | 1000000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1GX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA63,10X12,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | SERIAL | |
Programming Voltage | 1.8 V | |
Seated Height-Max | 1 mm | |
Standby Current-Max | 0.00005 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Type | NAND TYPE | |
Width | 9 mm | |
Write Cycle Time-Max (tWC) | 0.000025 ms | |
Write Protection | HARDWARE |