Part Details for TH50VSF2581AASB by Toshiba America Electronic Components
Overview of TH50VSF2581AASB by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for TH50VSF2581AASB
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 97 |
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RFQ |
Part Details for TH50VSF2581AASB
TH50VSF2581AASB CAD Models
TH50VSF2581AASB Part Data Attributes
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TH50VSF2581AASB
Toshiba America Electronic Components
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Datasheet
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TH50VSF2581AASB
Toshiba America Electronic Components
IC SPECIALTY MEMORY CIRCUIT, PBGA69, 12 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-69, Memory IC:Other
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA69,10X12,32 | |
| Pin Count | 69 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 90 ns | |
| Additional Feature | USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8 | |
| JESD-30 Code | R-PBGA-B69 | |
| JESD-609 Code | e0 | |
| Length | 12 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Mixed Memory Type | FLASH+SRAM | |
| Number of Functions | 1 | |
| Number of Terminals | 69 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA69,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 9 mm |
Alternate Parts for TH50VSF2581AASB
This table gives cross-reference parts and alternative options found for TH50VSF2581AASB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TH50VSF2581AASB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MX69LW162TXBI-70 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA66, 11 X 8 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MO-219, FBGA-66 | Macronix International Co Ltd | TH50VSF2581AASB vs MX69LW162TXBI-70 |
| MX69LW162BXBI-70 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA66, 11 X 8 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MO-219, FBGA-66 | Macronix International Co Ltd | TH50VSF2581AASB vs MX69LW162BXBI-70 |
| MX69LW164BXBI-70 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA66, 11 X 8 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MO-219, FBGA-66 | Macronix International Co Ltd | TH50VSF2581AASB vs MX69LW164BXBI-70 |
| MX69LW162TXBI-90 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA66, 11 X 8 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MO-219, FBGA-66 | Macronix International Co Ltd | TH50VSF2581AASB vs MX69LW162TXBI-90 |
| MX69LW164BXBI-90 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA66, 11 X 8 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MO-219, FBGA-66 | Macronix International Co Ltd | TH50VSF2581AASB vs MX69LW164BXBI-90 |