Part Details for TH50VSF1480AASB by Toshiba America Electronic Components
Overview of TH50VSF1480AASB by Toshiba America Electronic Components
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Part Details for TH50VSF1480AASB
TH50VSF1480AASB CAD Models
TH50VSF1480AASB Part Data Attributes
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TH50VSF1480AASB
Toshiba America Electronic Components
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TH50VSF1480AASB
Toshiba America Electronic Components
IC SPECIALTY MEMORY CIRCUIT, PBGA65, 12 X 9 MM, 0.80 MM PITCH, PLASTIC, LFBGA-65, Memory IC:Other
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA65,10X12,32 | |
| Pin Count | 65 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 100 ns | |
| Additional Feature | SRAM IS ORGANISED AS 128K X 16 | |
| JESD-30 Code | R-PBGA-B65 | |
| Length | 12 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Mixed Memory Type | FLASH+SRAM | |
| Number of Functions | 1 | |
| Number of Terminals | 65 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -20 °C | |
| Organization | 1MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA65,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 9 mm |