Part Details for TGL41-200A-E3/96 by Vishay Intertechnologies

A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the device, with multiple vias to the bottom layer to dissipate heat efficiently. Additionally, keeping the PCB layer as thin as possible and using a thermal interface material can further improve thermal performance.

To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device, and avoid applying excessive force or pressure. Inspect the solder joints for proper wetting and filleting.

The maximum allowed voltage derating for the TGL41-200A-E3/96 is typically 80% of the rated voltage, but this can vary depending on the specific application and environmental conditions. It's recommended to consult with a Vishay application engineer or a qualified design expert to determine the appropriate derating for your specific use case.

The TGL41-200A-E3/96 is a commercial-grade device, and its suitability for high-reliability or aerospace applications depends on the specific requirements of the project. Vishay offers other products that are specifically designed and qualified for high-reliability and aerospace applications. It's recommended to consult with a Vishay application engineer or a qualified design expert to determine the appropriate device for your specific use case.

To prevent damage during storage and shipping, it's recommended to store the devices in their original packaging or in a similar protective package, away from direct sunlight, moisture, and extreme temperatures. Avoid bending, flexing, or applying excessive force to the leads or package. Follow ESD precautions when handling the devices to prevent electrostatic discharge damage.