Datasheets
TE28F160S3-130 by: Intel Corporation

Flash, 2MX8, 130ns, PDSO56, 14 X 20 MM, TSOP-56

Part Details for TE28F160S3-130 by Intel Corporation

Overview of TE28F160S3-130 by Intel Corporation

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Part Details for TE28F160S3-130

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TE28F160S3-130 Part Data Attributes

TE28F160S3-130 Intel Corporation
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TE28F160S3-130 Intel Corporation Flash, 2MX8, 130ns, PDSO56, 14 X 20 MM, TSOP-56
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Part Package Code TSOP
Package Description TSOP1, TSSOP56,.8,20
Pin Count 56
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 130 ns
Additional Feature CONFIGURABLE AS 1M X 16; USER SELECTABLE AS 2.7V OR 3.3V OR 5V VPP
Alternate Memory Width 8
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G56
JESD-609 Code e0
Length 18.4 mm
Memory Density 16777216 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Sectors/Size 32
Number of Terminals 56
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX8
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP56,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Page Size 16/32 words
Parallel/Serial PARALLEL
Programming Voltage 2.7 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Toggle Bit NO
Type NOR TYPE
Width 14 mm

Alternate Parts for TE28F160S3-130

This table gives cross-reference parts and alternative options found for TE28F160S3-130. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TE28F160S3-130, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY27C256A-120JC OTP ROM, 32KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 Rochester Electronics LLC TE28F160S3-130 vs CY27C256A-120JC
HY27UF084G2-TPIP Flash, 512MX8, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48 SK Hynix Inc TE28F160S3-130 vs HY27UF084G2-TPIP
28LV64A-T-20/SO 8K X 8 EEPROM 3V, 200 ns, PDSO28, PLASTIC, SOIC-28 Microchip Technology Inc TE28F160S3-130 vs 28LV64A-T-20/SO
M27C405-150B1 512KX8 OTPROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics TE28F160S3-130 vs M27C405-150B1
AM28F010-70EI Flash, 128KX8, 70ns, PDSO32, TSOP-32 Rochester Electronics LLC TE28F160S3-130 vs AM28F010-70EI
28C010TRPGI-175 Memory IC, Data Device Corporation TE28F160S3-130 vs 28C010TRPGI-175
M27V512-120B6 64KX8 OTPROM, 120ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 STMicroelectronics TE28F160S3-130 vs M27V512-120B6
AM28F010-200LI Flash, 128KX8, 200ns, CQCC32, CERAMIC, LCC-32 Rochester Electronics LLC TE28F160S3-130 vs AM28F010-200LI
H1264C-55Y[REG][SLOW][PWRDOWN] MASK ROM, 8KX8, CMOS, CDIP28 Hughes Aircraft TE28F160S3-130 vs H1264C-55Y[REG][SLOW][PWRDOWN]
AM28F010-200C3LIB Flash Rochester Electronics LLC TE28F160S3-130 vs AM28F010-200C3LIB

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