Part Details for TDK5116F by Infineon Technologies AG
Results Overview of TDK5116F by Infineon Technologies AG
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Electronic Manufacturing
TDK5116F Information
TDK5116F by Infineon Technologies AG is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for TDK5116F
TDK5116F CAD Models
TDK5116F Part Data Attributes
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TDK5116F
Infineon Technologies AG
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Datasheet
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TDK5116F
Infineon Technologies AG
Telecom Circuit, 1-Func, Bipolar, PDSO10, GREEN, PLASTIC, TSSOP-10
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | TSSOP | |
| Package Description | TSSOP, TSSOP10,.19,20 | |
| Pin Count | 10 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Infineon | |
| JESD-30 Code | S-PDSO-G10 | |
| Length | 3 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP10,.19,20 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Supply Current-Max | 0.021 mA | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Width | 3 mm |
TDK5116F Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
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Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling capability at high temperatures.
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Exceeding the maximum Tj rating can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure the device operates within the recommended temperature range.
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Use proper shielding, filtering, and grounding techniques. Ensure the device is placed in a shielded environment, and use EMI filters or common-mode chokes to minimize emissions.
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Follow the recommended soldering profile: 260°C peak temperature, 30-45 seconds dwell time, and 10-20 seconds ramp-up and cool-down times. For rework, use a low-temperature soldering iron and a thermal protection device.