Part Details for TDK5100 by Infineon Technologies AG
Overview of TDK5100 by Infineon Technologies AG
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- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Price & Stock for TDK5100
Part # | Distributor | Description | Stock | Price | Buy | |
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Chip1Cloud | ASK/FSK Transmitter 868/433 MHz | 28092 |
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RFQ | |
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Perfect Parts Corporation | 15091 |
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RFQ |
Part Details for TDK5100
TDK5100 CAD Models
TDK5100 Part Data Attributes
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TDK5100
Infineon Technologies AG
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Datasheet
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TDK5100
Infineon Technologies AG
Telecom Circuit, 1-Func, Bipolar, PDSO16, PLASTIC, TSSOP-16
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Part Package Code | TSSOP | |
Package Description | TSSOP, TSSOP16,.25 | |
Pin Count | 16 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Infineon | |
JESD-30 Code | R-PDSO-G16 | |
JESD-609 Code | e3 | |
Length | 5 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP16,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Current-Max | 0.0095 mA | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Width | 4.4 mm |