Part Details for TDF8591TH/N1,118 by NXP Semiconductors
Overview of TDF8591TH/N1,118 by NXP Semiconductors
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Part Details for TDF8591TH/N1,118
TDF8591TH/N1,118 CAD Models
TDF8591TH/N1,118 Part Data Attributes
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TDF8591TH/N1,118
NXP Semiconductors
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TDF8591TH/N1,118
NXP Semiconductors
TDF8591TH - 2 x 100 W SE (4 Ohm) or 1 x 310 W BTL (4 Ohm) class-D amplifier SOIC 24-Pin
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SOIC | |
| Package Description | SSOP, SOP24,.56,40 | |
| Pin Count | 24 | |
| Manufacturer Package Code | SOT566-3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Bandwidth-Nom | 20 kHz | |
| Consumer IC Type | CLASS D AUDIO AMPLIFIER | |
| Gain | 32 dB | |
| Harmonic Distortion | 10% | |
| JESD-30 Code | R-PDSO-G24 | |
| Length | 15.9 mm | |
| Number of Channels | 2 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Power-Nom | 310 W | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SSOP | |
| Package Equivalence Code | SOP24,.56,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, SHRINK PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.5 mm | |
| Supply Voltage-Max (Vsup) | 29 V | |
| Supply Voltage-Min (Vsup) | 14 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1 mm | |
| Terminal Position | DUAL | |
| Width | 11 mm |