There are no models available for this part yet.
Overview of TDA8024TT by Philips Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Electronic Manufacturing
CAD Models for TDA8024TT by Philips Semiconductors
Part Data Attributes for TDA8024TT by Philips Semiconductors
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
PHILIPS SEMICONDUCTORS
|
Package Description
|
TSSOP, TSSOP28,.25
|
Reach Compliance Code
|
unknown
|
HTS Code
|
8542.31.00.01
|
JESD-30 Code
|
R-PDSO-G28
|
Number of Terminals
|
28
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-25 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TSSOP
|
Package Equivalence Code
|
TSSOP28,.25
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Surface Mount
|
YES
|
Temperature Grade
|
OTHER
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.635 mm
|
Terminal Position
|
DUAL
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR CIRCUIT
|
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