There are no models available for this part yet.
Overview of TDA6500TT by Philips Semiconductors
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Electronic Manufacturing
Entertainment and Gaming
CAD Models for TDA6500TT by Philips Semiconductors
Part Data Attributes for TDA6500TT by Philips Semiconductors
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|---|---|
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Rohs Code
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Yes
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Part Life Cycle Code
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Transferred
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Ihs Manufacturer
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PHILIPS SEMICONDUCTORS
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Package Description
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TSSOP, TSSOP32,.3
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Reach Compliance Code
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unknown
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HTS Code
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8542.39.00.01
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JESD-30 Code
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R-PDSO-G32
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Number of Terminals
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32
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
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-20 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TSSOP
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Package Equivalence Code
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TSSOP32,.3
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
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Peak Reflow Temperature (Cel)
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260
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Qualification Status
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Not Qualified
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Supply Current-Max
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122 mA
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Surface Mount
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YES
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Temperature Grade
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OTHER
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Terminal Form
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GULL WING
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Terminal Pitch
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0.635 mm
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Terminal Position
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DUAL
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