Part Details for TC9327BFG by Toshiba America Electronic Components
Overview of TC9327BFG by Toshiba America Electronic Components
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Applications
Education and Research
Environmental Monitoring
Industrial Automation
Agriculture Technology
Medical Imaging
Part Details for TC9327BFG
TC9327BFG CAD Models
TC9327BFG Part Data Attributes
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TC9327BFG
Toshiba America Electronic Components
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Datasheet
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TC9327BFG
Toshiba America Electronic Components
IC 4-BIT, OTPROM, 0.075 MHz, MICROCONTROLLER, PQFP80, 12 X 12 MM, 0.50 MM PITCH, PLASTIC, LQFP-80, Microcontroller
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | QFP | |
Package Description | 12 X 12 MM, 0.50 MM PITCH, PLASTIC, LQFP-80 | |
Pin Count | 80 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 4 | |
Boundary Scan | NO | |
Clock Frequency-Max | 0.075 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G80 | |
Length | 12 mm | |
Number of I/O Lines | 36 | |
Number of Terminals | 80 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 60 °C | |
Operating Temperature-Min | -10 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | QFP80,.55SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Qualification Status | Not Qualified | |
RAM (bytes) | 128 | |
ROM (words) | 28672 | |
ROM Programmability | OTPROM | |
Seated Height-Max | 1.85 mm | |
Speed | 0.075 MHz | |
Supply Current-Max | 12 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 12 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |