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Part Details for TC74VHCV17FK by Toshiba America Electronic Components
Overview of TC74VHCV17FK by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TC74VHCV17FK
TC74VHCV17FK CAD Models
TC74VHCV17FK Part Data Attributes
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TC74VHCV17FK
Toshiba America Electronic Components
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TC74VHCV17FK
Toshiba America Electronic Components
IC AHC/VHC/H/U/V SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14, 3 MM, 0.50 MM PITCH, PLASTIC, VSSOP-14, Gate
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | SSOP | |
| Package Description | VSSOP, | |
| Pin Count | 14 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Toshiba | |
| Family | AHC/VHC/H/U/V | |
| JESD-30 Code | R-PDSO-G14 | |
| Length | 4 mm | |
| Logic IC Type | BUFFER | |
| Number of Functions | 6 | |
| Number of Inputs | 1 | |
| Number of Terminals | 14 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Propagation Delay (tpd) | 27 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.8 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 3 mm |