Part Details for TC59LM913AMG-50 by Toshiba America Electronic Components
Overview of TC59LM913AMG-50 by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for TC59LM913AMG-50
TC59LM913AMG-50 CAD Models
TC59LM913AMG-50 Part Data Attributes
|
|
TC59LM913AMG-50
Toshiba America Electronic Components
Buy Now
Datasheet
|
Compare Parts:
TC59LM913AMG-50
Toshiba America Electronic Components
IC 32M X 16 DDR DRAM, 0.65 ns, PBGA64, 13 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-64, Dynamic RAM
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | BGA | |
| Package Description | TBGA, BGA60,6X15,40 | |
| Pin Count | 64 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.65 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 2,4 | |
| JESD-30 Code | R-PBGA-B64 | |
| Length | 16.5 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | DDR1 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 64 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 32MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA60,6X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 2,4 | |
| Supply Voltage-Max (Vsup) | 2.65 V | |
| Supply Voltage-Min (Vsup) | 2.35 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 12.7 mm |
Alternate Parts for TC59LM913AMG-50
This table gives cross-reference parts and alternative options found for TC59LM913AMG-50. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC59LM913AMG-50, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TC59LM913AMB-50 | IC 32M X 16 DDR DRAM, 0.65 ns, PBGA64, 13 X 17 MM, 1 MM PITCH, PLASTIC, BGA-64, Dynamic RAM | Toshiba America Electronic Components | TC59LM913AMG-50 vs TC59LM913AMB-50 |