There are no models available for this part yet.
Overview of TC58NYG0S3HBAI6 by KIOXIA
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for TC58NYG0S3HBAI6 by KIOXIA
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
TC58NYG0S3HBAI6-ND
|
DigiKey | IC FLASH 1GBIT PARALLEL 67VFBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray |
281 In Stock |
|
$1.9866 / $3.0800 | Buy Now | |
DISTI #
757-TC58NYG0S3HBAI6
|
Mouser Electronics | NAND Flash 1.8V 1Gb 24nm I-Temp SLC NAND (EEPROM) RoHS: Compliant | 0 |
|
$2.4600 / $3.0500 | Order Now | |
LCSC | 1.7V1.95V 1Gbit VFBGA-67 NAND FLASH ROHS | 2 |
|
$2.5615 / $3.9482 | Buy Now |
CAD Models for TC58NYG0S3HBAI6 by KIOXIA
Part Data Attributes for TC58NYG0S3HBAI6 by KIOXIA
|
|
---|---|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
KIOXIA HOLDINGS CORP
|
Package Description
|
VFBGA-67
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
JESD-30 Code
|
R-PBGA-B67
|
Length
|
8 mm
|
Memory Density
|
1073741824 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
67
|
Number of Words
|
134217728 words
|
Number of Words Code
|
128000000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
128MX8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
VFBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial
|
PARALLEL
|
Programming Voltage
|
1.8 V
|
Seated Height-Max
|
1 mm
|
Supply Voltage-Max (Vsup)
|
1.95 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Type
|
SLC NAND TYPE
|
Width
|
6.5 mm
|
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