Part Details for TC58NYG0S3ETAI0 by Toshiba America Electronic Components
Overview of TC58NYG0S3ETAI0 by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TC58NYG0S3ETAI0
TC58NYG0S3ETAI0 CAD Models
TC58NYG0S3ETAI0 Part Data Attributes
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TC58NYG0S3ETAI0
Toshiba America Electronic Components
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Datasheet
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TC58NYG0S3ETAI0
Toshiba America Electronic Components
IC 128M X 8 FLASH 1.8V PROM, PDSO48, 12 X 20 MM, 050 MM PITCH, PLASTIC, TSOP-48, Programmable ROM
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | TSOP | |
| Package Description | TSSOP, | |
| Pin Count | 48 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| JESD-30 Code | R-PDSO-G48 | |
| Length | 18.4 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 1.8 V | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL |
Alternate Parts for TC58NYG0S3ETAI0
This table gives cross-reference parts and alternative options found for TC58NYG0S3ETAI0. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC58NYG0S3ETAI0, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C64-150DCB | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | TC58NYG0S3ETAI0 vs AM27C64-150DCB |
| CY27C64-150JC | OTP ROM, 8KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | TC58NYG0S3ETAI0 vs CY27C64-150JC |
| CY27C256A-120JC | OTP ROM, 32KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | TC58NYG0S3ETAI0 vs CY27C256A-120JC |
| 28LV64A-T-20/SO | 8K X 8 EEPROM 3V, 200 ns, PDSO28, PLASTIC, SOIC-28 | Microchip Technology Inc | TC58NYG0S3ETAI0 vs 28LV64A-T-20/SO |
| AM29LV400B100FC | Flash, 256KX16, 100ns, PDSO48, REVERSE, TSOP-48 | Spansion | TC58NYG0S3ETAI0 vs AM29LV400B100FC |
| LH28F800SGHN-L100 | Flash, 512KX16, 100ns, PDSO44, 28.20 X 16 MM, PLASTIC, SOP-44 | Sharp Corp | TC58NYG0S3ETAI0 vs LH28F800SGHN-L100 |
| WS57C256F-35J | UVPROM, 32KX8, 35ns, CMOS, PQCC32, PLASTIC, LDCC-32 | Teledyne e2v | TC58NYG0S3ETAI0 vs WS57C256F-35J |
| AM28F010-120C4LCB | Flash | Rochester Electronics LLC | TC58NYG0S3ETAI0 vs AM28F010-120C4LCB |
| M5M28F102FP-12 | Flash, 64KX16, 120ns, PDSO40, 0.525 INCH, PLASTIC, SOP-40 | Mitsubishi Electric | TC58NYG0S3ETAI0 vs M5M28F102FP-12 |
| AT27C512R-15LC | UVPROM, 64KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | Atmel Corporation | TC58NYG0S3ETAI0 vs AT27C512R-15LC |