Memory
TC58NVG1S3HTA00
Description: 2GB SLC NAND TSOP 24NM LB (EEPROM)

Overview of TC58NVG1S3HTA00 by Toshiba America Electronic Components

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
  • Distributor Offerings: ( 5 listings )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Available )
  • Number of Functional Equivalents: ( 0 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )

Price & Stock for TC58NVG1S3HTA00 by Toshiba America Electronic Components

Part # Manufacturer Description Stock Price Buy
Bristol Electronics   3098
RFQ
Bristol Electronics   34
RFQ
Quest Components   2478
  • 1 $4.2588
  • 382 $2.3423
  • 855 $2.1294
$2.1294 / $4.2588 Buy Now
Quest Components   27
  • 1 $3.5490
  • 4 $2.9575
  • 9 $2.6026
$2.6026 / $3.5490 Buy Now
DISTI # SMC-TC58NVG1S3HTA00
Sensible Micro Corporation AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days Date Code: 23+ 200000
RFQ

CAD Models for TC58NVG1S3HTA00 by Toshiba America Electronic Components
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Part Data Attributes for TC58NVG1S3HTA00 by Toshiba America Electronic Components

TC58NVG1S3HTA00
Toshiba America Electronic Components
-
-
Rohs Code
Yes
Part Life Cycle Code
Transferred
Ihs Manufacturer
TOSHIBA CORP
Part Package Code
TSOP1
Package Description
TSOP1-48
Pin Count
48
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Samacsys Manufacturer
Toshiba
JESD-30 Code
R-PDSO-G48
Length
18.4 mm
Memory Density
2147483648 bit
Memory IC Type
FLASH
Memory Width
8
Number of Functions
1
Number of Terminals
48
Number of Words
268435456 words
Number of Words Code
256000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256MX8
Package Body Material
PLASTIC/EPOXY
Package Code
TSOP
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
SERIAL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3.3 V
Seated Height-Max
1.2 mm
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
10
Type
SLC NAND TYPE
Width
12 mm
Write Protection
HARDWARE
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    Toshiba America Electronic Components
    2GB SLC NAND TSOP 24NM LB (EEPROM)
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