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Memory / EEPROMs / TC58DVG02D5TA00
Datasheets
TC58DVG02D5TA00 by:
Toshiba America Electronic Components
Hongxing Electrical Ltd
Toshiba America Electronic Components
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IC EEPROM 3V, Programmable ROM

Part Details for TC58DVG02D5TA00 by Toshiba America Electronic Components

Results Overview of TC58DVG02D5TA00 by Toshiba America Electronic Components

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

TC58DVG02D5TA00 Information

TC58DVG02D5TA00 by Toshiba America Electronic Components is an EEPROM.
EEPROMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Part Details for TC58DVG02D5TA00

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TC58DVG02D5TA00 Part Data Attributes

Parametric Data
TC58DVG02D5TA00 Toshiba America Electronic Components
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TC58DVG02D5TA00 Toshiba America Electronic Components IC EEPROM 3V, Programmable ROM
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Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code TSOP1
Package Description TSOP1, TSSOP48,.8,20
Pin Count 48
Reach Compliance Code unknown
ECCN Code 3A991.B.1.B.1
HTS Code 8542.32.00.51
Access Time-Max 25 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48
Length 18.4 mm
Memory Density 1073741824 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Sectors/Size 1K
Number of Terminals 48
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128MX8
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Page Size 2K words
Parallel/Serial PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Toggle Bit NO
Type NAND TYPE
Width 12 mm

TC58DVG02D5TA00 Frequently Asked Questions (FAQ)

  • Toshiba provides a recommended PCB layout in their application note (TAEC-AN-2013-001) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.

  • The TC58DVG02D5TA00 has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. Additionally, Toshiba recommends using a thermal interface material (TIM) between the thermal pad and the thermal plane to reduce thermal resistance.

  • The TC58DVG02D5TA00 has an operating temperature range of -40°C to 85°C, but it's recommended to operate within -20°C to 70°C for optimal performance and reliability.

  • The TC58DVG02D5TA00 can be programmed using a serial interface (SPI or QSPI) and requires a specific programming sequence and protocol. Toshiba provides a programming guide and software tools to assist with the programming process.

  • The TC58DVG02D5TA00 has a data retention period of 10 years at 85°C, and 100 years at 25°C, based on Toshiba's testing and characterization.