Part Details for TC58BYG2S0HBAI6 by KIOXIA
Overview of TC58BYG2S0HBAI6 by KIOXIA
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for TC58BYG2S0HBAI6
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
TC58BYG2S0HBAI6-ND
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DigiKey | IC FLASH 4GBIT PARALLEL 67VFBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray |
297 In Stock |
|
$3.5431 / $5.0700 | Buy Now |
|
DISTI #
757-TC58BYG2S0HBAI6
|
Mouser Electronics | NAND Flash 1.8V 4Gb 24nm SLC NAND (EEPROM) RoHS: Compliant | 0 |
|
$3.7000 / $5.0900 | Order Now |
Part Details for TC58BYG2S0HBAI6
TC58BYG2S0HBAI6 CAD Models
TC58BYG2S0HBAI6 Part Data Attributes
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TC58BYG2S0HBAI6
KIOXIA
Buy Now
Datasheet
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Compare Parts:
TC58BYG2S0HBAI6
KIOXIA
Flash, 512MX8, PBGA67, VFBGA-67
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | KIOXIA HOLDINGS CORP | |
| Package Description | VFBGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | KIOXIA Corporation | |
| Access Time-Max | 25 ns | |
| JESD-30 Code | R-PBGA-B67 | |
| Length | 8 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 67 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA67,8X10,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 1.8 V | |
| Seated Height-Max | 1 mm | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Type | NAND TYPE | |
| Width | 6.5 mm | |
| Write Cycle Time-Max (tWC) | 2.5e-8 ms | |
| Write Protection | HARDWARE |