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Part Details for TC58BVG2S0HTA00 by Toshiba America Electronic Components
Overview of TC58BVG2S0HTA00 by Toshiba America Electronic Components
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Part Details for TC58BVG2S0HTA00
TC58BVG2S0HTA00 CAD Models
TC58BVG2S0HTA00 Part Data Attributes
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TC58BVG2S0HTA00
Toshiba America Electronic Components
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TC58BVG2S0HTA00
Toshiba America Electronic Components
IC FLASH 3.3V PROM, Programmable ROM
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | TSOP1 | |
| Package Description | TSOP1, | |
| Pin Count | 48 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Toshiba | |
| Access Time-Max | 25 ns | |
| JESD-30 Code | R-PDSO-G48 | |
| Length | 18.4 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP1 | |
| Package Equivalence Code | TSSOP48,.8,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3.3 V | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Type | NAND TYPE | |
| Width | 12 mm | |
| Write Cycle Time-Max (tWC) | 0.000025 ms | |
| Write Protection | HARDWARE |