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Overview of TC58BVG1S3HBAI6 by Toshiba America Electronic Components
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
CAD Models for TC58BVG1S3HBAI6 by Toshiba America Electronic Components
Part Data Attributes for TC58BVG1S3HBAI6 by Toshiba America Electronic Components
|
|
---|---|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
TOSHIBA CORP
|
Part Package Code
|
BGA
|
Package Description
|
VFBGA,
|
Pin Count
|
67
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Samacsys Manufacturer
|
Toshiba
|
JESD-30 Code
|
R-PBGA-B67
|
Length
|
8 mm
|
Memory Density
|
2147483648 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
67
|
Number of Words
|
268435456 words
|
Number of Words Code
|
256000000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
256MX8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
VFBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial
|
PARALLEL
|
Programming Voltage
|
3.3 V
|
Seated Height-Max
|
1 mm
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Width
|
6.5 mm
|
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