There are no models available for this part yet.
Overview of TC571000D-25 by Toshiba America Electronic Components
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Space Technology
Computing and Data Storage
Aerospace and Defense
CAD Models for TC571000D-25 by Toshiba America Electronic Components
Part Data Attributes for TC571000D-25 by Toshiba America Electronic Components
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
TOSHIBA CORP
|
|
Part Package Code
|
DIP
|
|
Package Description
|
WDIP,
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
250 ns
|
|
JESD-30 Code
|
R-GDIP-T32
|
|
JESD-609 Code
|
e0
|
|
Length
|
42 mm
|
|
Memory Density
|
1048576 bit
|
|
Memory IC Type
|
UVPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
131072 words
|
|
Number of Words Code
|
128000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
128KX8
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
WDIP
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE, WINDOW
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
6.1 mm
|
|
Supply Current-Max
|
0.01 mA
|
|
Supply Voltage-Max (Vsup)
|
5.25 V
|
|
Supply Voltage-Min (Vsup)
|
4.75 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
15.24 mm
|
Alternate Parts for TC571000D-25
This table gives cross-reference parts and alternative options found for TC571000D-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC571000D-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8961402XX | UVPROM, 128KX8, 250ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | Waferscale Integration Inc | TC571000D-25 vs 5962-8961402XX |
| AM27C100-255DIB | UVPROM, 128KX8, 250ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | TC571000D-25 vs AM27C100-255DIB |
| 5962-8961402XX | UVPROM, 128KX8, 250ns, CMOS, CDIP32 | AMD | TC571000D-25 vs 5962-8961402XX |
| 5962-8961402XA | UVPROM, 128KX8, 250ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | TC571000D-25 vs 5962-8961402XA |
| DPV27C101-250C | UVPROM, 128KX8, 250ns, CMOS, CDIP32, CERDIP-32 | Twilight Technology Inc | TC571000D-25 vs DPV27C101-250C |
| AT27LV010-25DI | UVPROM, 128KX8, 250ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | TC571000D-25 vs AT27LV010-25DI |
| M27C1001-25XF1 | 128KX8 UVPROM, 250ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 | STMicroelectronics | TC571000D-25 vs M27C1001-25XF1 |
| HN27C301AG-25 | UVPROM, 128KX8, 250ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32 | Hitachi Ltd | TC571000D-25 vs HN27C301AG-25 |
| DPV27C101-250I | UVPROM, 128KX8, 250ns, CMOS, CDIP32, CERDIP-32 | Twilight Technology Inc | TC571000D-25 vs DPV27C101-250I |
| AT27C010-25DC | UVPROM, 128KX8, 250ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | TC571000D-25 vs AT27C010-25DC |