Part Details for TC571000D-200 by Toshiba America Electronic Components
Overview of TC571000D-200 by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Space Technology
Computing and Data Storage
Aerospace and Defense
Part Details for TC571000D-200
TC571000D-200 CAD Models
TC571000D-200 Part Data Attributes
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TC571000D-200
Toshiba America Electronic Components
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Datasheet
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TC571000D-200
Toshiba America Electronic Components
IC 128K X 8 UVPROM, 200 ns, CDIP32, CERDIP-32, Programmable ROM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | DIP | |
| Package Description | WDIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-GDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 42 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 6.1 mm | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for TC571000D-200
This table gives cross-reference parts and alternative options found for TC571000D-200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC571000D-200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AT27CL010-20DM/883 | UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | TC571000D-200 vs AT27CL010-20DM/883 |
| M27C1001-20XF1 | 128KX8 UVPROM, 200ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 | STMicroelectronics | TC571000D-200 vs M27C1001-20XF1 |
| AM27C010-200DC | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | TC571000D-200 vs AM27C010-200DC |
| DPV27C101-200B | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 | B&B Electronics Manufacturing Company | TC571000D-200 vs DPV27C101-200B |
| 5962-8961403XA | UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | TC571000D-200 vs 5962-8961403XA |
| AT27LV010-20DC | UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | TC571000D-200 vs AT27LV010-20DC |
| AM27C010-200DEB | UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | TC571000D-200 vs AM27C010-200DEB |
| NMC27C010Q20 | 128KX8 UVPROM, 200ns, CDIP32, CERAMIC, DIP-32 | Texas Instruments | TC571000D-200 vs NMC27C010Q20 |
| DPV27C101-200C | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 | B&B Electronics Manufacturing Company | TC571000D-200 vs DPV27C101-200C |
| AM27C010-200DEB | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | TC571000D-200 vs AM27C010-200DEB |