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IC,SRAM,2KX8,CMOS,DIP,24PIN,PLASTIC
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TC5516AP-2
Toshiba America Electronic Components
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Datasheet
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TC5516AP-2
Toshiba America Electronic Components
IC,SRAM,2KX8,CMOS,DIP,24PIN,PLASTIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Package Description | DIP, DIP24,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Samacsys Manufacturer | Toshiba | |
Access Time-Max | 200 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PDIP-T24 | |
JESD-609 Code | e0 | |
Memory Density | 16384 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Terminals | 24 | |
Number of Words | 2048 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -30 °C | |
Organization | 2KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.00003 A | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |