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Part Details for TC277TP64F200NDCLXUMA1 by Infineon Technologies AG
Overview of TC277TP64F200NDCLXUMA1 by Infineon Technologies AG
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Price & Stock for TC277TP64F200NDCLXUMA1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
04AJ4754
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Newark | Mcu, 32Bit, 200Mhz, Tqfp-292 Rohs Compliant: Yes |Infineon TC277TP64F200NDCLXUMA1 Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 0 |
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$32.4100 | Buy Now |
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DISTI #
448-TC277TP64F200NDCLXUMA1TR-ND
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DigiKey | IC MCU 32BIT 4MB FLASH 292LFBGA Min Qty: 1000 Lead time: 33 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$24.5490 | Buy Now |
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DISTI #
TC277TP64F200NDCLX
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Avnet Americas | 32-Bit Microcontroller Tri Core 4MB Flash/ 472KB SRAM 200MHz 292-Ball PG-LFBGA T/R - Tape and Reel (Alt: TC277TP64F200NDCLX) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 53 Weeks, 1 Days Container: Reel | 0 |
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$28.9802 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 33 Weeks Container: Reel | 0Reel |
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$28.7700 | Buy Now |
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Chip1Cloud | IC MCU 32BIT 4MB FLASH 292LFBGA | 1490 |
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RFQ | |
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DISTI #
SP001662598
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EBV Elektronik | 32-Bit Microcontroller Tri Core 4MB Flash/ 472KB SRAM 200MHz 292-Ball PG-LFBGA T/R (Alt: SP001662598) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 34 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for TC277TP64F200NDCLXUMA1
TC277TP64F200NDCLXUMA1 CAD Models
TC277TP64F200NDCLXUMA1 Part Data Attributes
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TC277TP64F200NDCLXUMA1
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
TC277TP64F200NDCLXUMA1
Infineon Technologies AG
Microcontroller, 32-Bit, FLASH, 200MHz, CMOS, PBGA292, LFBGA-292
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | LFBGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 53 Weeks, 1 Day | |
| Samacsys Manufacturer | Infineon | |
| Has ADC | YES | |
| Additional Feature | 60 A/D INPUT LINES; 14 NUMBER OF ADC MODULES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | NO | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B292 | |
| JESD-609 Code | e2 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 292 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| RAM (bytes) | 483328 | |
| ROM (words) | 4194304 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.7 mm | |
| Speed | 200 MHz | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 17 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |