Part Details for TC233LP32F200FABKXUMA1 by Infineon Technologies AG
Overview of TC233LP32F200FABKXUMA1 by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for TC233LP32F200FABKXUMA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
TC233LP32F200FABKXUMA1CT-ND
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DigiKey | IC MCU 32BIT 2MB FLASH 100TQFP Min Qty: 1 Lead time: 43 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
1000 In Stock |
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$10.7887 / $17.0300 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Container: Reel | 0Reel |
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$12.3600 | Buy Now |
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DISTI #
SP001268348
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EBV Elektronik | MCU 32-Bit AURIX TriCore RISC 2MB Flash 3.3V 100-Pin TQFP EP T/R (Alt: SP001268348) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 6 Weeks, 2 Days | EBV - 0 |
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Buy Now |
Part Details for TC233LP32F200FABKXUMA1
TC233LP32F200FABKXUMA1 CAD Models
TC233LP32F200FABKXUMA1 Part Data Attributes:
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TC233LP32F200FABKXUMA1
Infineon Technologies AG
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Datasheet
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TC233LP32F200FABKXUMA1
Infineon Technologies AG
Microcontroller, 32-Bit, FLASH, 200MHz, CMOS, PQFP100, GREEN, PLASTIC, TQFP-100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | GREEN, PLASTIC, TQFP-100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Infineon | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 200 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G100 | |
| Length | 12 mm | |
| Number of Terminals | 100 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| ROM (words) | 32768 | |
| ROM Programmability | FLASH | |
| Speed | 200 MHz | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |