Part Details for TC1130L150EBGBBFXQSA1 by Infineon Technologies AG
Overview of TC1130L150EBGBBFXQSA1 by Infineon Technologies AG
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for TC1130L150EBGBBFXQSA1
TC1130L150EBGBBFXQSA1 CAD Models
TC1130L150EBGBBFXQSA1 Part Data Attributes:
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TC1130L150EBGBBFXQSA1
Infineon Technologies AG
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TC1130L150EBGBBFXQSA1
Infineon Technologies AG
Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA208, PLASTIC, LBGA-208
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | NO | |
| Additional Feature | ALSO REQUIRES 3.3V I/O SUPPLY | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B208 | |
| Length | 17 mm | |
| Number of I/O Lines | 72 | |
| Number of Terminals | 208 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 150 MHz | |
| Supply Voltage-Max | 1.58 V | |
| Supply Voltage-Min | 1.43 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 17 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |