Datasheets
TBP24S10J by: Texas Instruments

256X4 OTPROM, 55ns, CDIP16, CERAMIC, DIP-16

Part Details for TBP24S10J by Texas Instruments

Overview of TBP24S10J by Texas Instruments

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for TBP24S10J

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TBP24S10J Part Data Attributes:

TBP24S10J Texas Instruments
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TBP24S10J Texas Instruments 256X4 OTPROM, 55ns, CDIP16, CERAMIC, DIP-16
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code DIP
Package Description DIP, DIP16,.3
Pin Count 16
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 55 ns
JESD-30 Code R-GDIP-T16
Length 19.56 mm
Memory Density 1024 bit
Memory IC Type OTP ROM
Memory Width 4
Number of Functions 1
Number of Terminals 16
Number of Words 256 words
Number of Words Code 256
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256X4
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Alternate Parts for TBP24S10J

This table gives cross-reference parts and alternative options found for TBP24S10J. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TBP24S10J, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
53S141J OTP ROM, 256X4, 55ns, CMOS, CDIP16, Monolithic Memories (RETIRED) TBP24S10J vs 53S141J
Part Number Description Manufacturer Compare
AM27S20PCB OTP ROM, 256X4, 45ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD TBP24S10J vs AM27S20PCB
N82S129AD-T 256X4 OTPROM, 27ns, PDSO16 Philips Semiconductors TBP24S10J vs N82S129AD-T
M38510/20302BEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors TBP24S10J vs M38510/20302BEX
M38510/20304BEA IC 256 X 4 OTPROM, 35 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors TBP24S10J vs M38510/20304BEA
DM74S287N 256X4 OTPROM, 50ns, PDIP16, PLASTIC, DIP-16 Texas Instruments TBP24S10J vs DM74S287N
AM27S20ADC OTP ROM, 256X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD TBP24S10J vs AM27S20ADC
53S141J OTP ROM, 256X4, 55ns, CMOS, CDIP16, Monolithic Memories (RETIRED) TBP24S10J vs 53S141J
AM27S21PC OTP ROM, 256X4, 45ns, Bipolar, PDIP16, PLASTIC, DIP-16 Rochester Electronics LLC TBP24S10J vs AM27S21PC
N82S229B 256X4 OTPROM, 50ns, PDIP16 Philips Semiconductors TBP24S10J vs N82S229B
TBP24S10MJ 256X4 OTPROM, 75ns, CDIP16, CERAMIC, DIP-16 Texas Instruments TBP24S10J vs TBP24S10MJ

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