Part Details for TB62217AFG by Toshiba America Electronic Components
Overview of TB62217AFG by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for TB62217AFG
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
TB62217AFG
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Avnet Americas | BDC MOTOR DRIVER, 2 H-BRIDGE, 40V/2.5A, QFN PKG IC - Trays (Alt: TB62217AFG) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Container: Tray | 0 |
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RFQ |
Part Details for TB62217AFG
TB62217AFG CAD Models
TB62217AFG Part Data Attributes
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TB62217AFG
Toshiba America Electronic Components
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Datasheet
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TB62217AFG
Toshiba America Electronic Components
IC STEPPER MOTOR CONTROLLER, 1.3 A, PQFP64, 10 X 10 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, THQFP-64, Motion Control Electronics
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Part Life Cycle Code | Active | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | QFP | |
Package Description | HTFQFP, TQFP64,.47SQ | |
Pin Count | 64 | |
Reach Compliance Code | unknown | |
Additional Feature | SELECTABLE BRUSH DC MOTOR DRIVER | |
Analog IC - Other Type | STEPPER MOTOR CONTROLLER | |
JESD-30 Code | S-PQFP-G64 | |
JESD-609 Code | e2 | |
Length | 10 mm | |
Number of Functions | 1 | |
Number of Terminals | 64 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Current-Max | 1.3 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HTFQFP | |
Package Equivalence Code | TQFP64,.47SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | BCDMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 10 mm |