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Microcontrollers and Processors / Other uPs/uCs/Peripheral ICs / T2080NSE8TTB
Datasheets
T2080NSE8TTB by: NXP Semiconductors

SoC, CMOS, PBGA896

Part Details for T2080NSE8TTB by NXP Semiconductors

Results Overview of T2080NSE8TTB by NXP Semiconductors

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T2080NSE8TTB Information

T2080NSE8TTB by NXP Semiconductors is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for T2080NSE8TTB

Part # Distributor Description Stock Price Buy
DISTI # 44Y6345
Newark Qoriq, 64B Power Arch, 8X 1.8Ghz Threads, 1.87Gt/S Ddr3/3L, 4X10Ge, Crypto Enabled, 0-105C, Rev 1.1/... Tray Rohs Compliant: Yes |Nxp T2080NSE8TTB more RoHS: Compliant Min Qty: 44 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 25 $302.3000
$302.3000 Buy Now
DISTI # 2832-T2080NSE8TTB-ND
DigiKey IC MPU QORIQ T2 1.8GHZ 896FCPBGA Min Qty: 5 Lead time: 18 Weeks Container: Tray MARKETPLACE PRODUCT 16
In Stock
  • 5 $307.6900
$307.6900 Buy Now
DISTI # T2080NSE8TTB-ND
DigiKey IC MPU QORIQ T2 1.8GHZ 896FCPBGA Min Qty: 5 Lead time: 18 Weeks Container: Tray Temporarily Out of Stock
  • 44 $319.1139
$319.1139 Buy Now
DISTI # T2080NSE8TTB
Avnet Americas MPU QorIQ RISC 64Bit 1800MHz 2.5V 896-Pin FCBGA Box - Trays (Alt: T2080NSE8TTB) Min Qty: 44 Package Multiple: 44 Lead time: 18 Weeks, 0 Days Container: Tray 0
  • 44 $272.3011
  • 176 $267.6858
  • 264 $265.3781
  • 352 $263.0705
$263.0705 / $272.3011 Buy Now
DISTI # 841-T2080NSE8TTB
Mouser Electronics Microprocessors - MPU 1.87GT/s DDR3/3L 4x10GE RoHS: Compliant 0
  • 1 $317.6400
  • 10 $310.1000
$310.1000 / $317.6400 Order Now
Rochester Electronics T2080E w/ SEC 1.8G w/Lid RoHS: Compliant Status: Active Min Qty: 1 88
  • 1 $320.5100
  • 25 $314.1000
  • 100 $301.2800
  • 500 $288.4600
  • 1,000 $272.4300
$272.4300 / $320.5100 Buy Now
DISTI # T2080NSE8TTB
Avnet Silica (Alt: T2080NSE8TTB) RoHS: Compliant Min Qty: 44 Package Multiple: 44 Lead time: 20 Weeks, 0 Days Silica - 0
Buy Now
DISTI # T2080NSE8TTB
EBV Elektronik (Alt: T2080NSE8TTB) RoHS: Compliant Min Qty: 44 Package Multiple: 44 Lead time: 20 Weeks, 0 Days EBV - 0
Buy Now
Flip Electronics Stock, ship today 16
RFQ

Part Details for T2080NSE8TTB

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T2080NSE8TTB Part Data Attributes

Parametric Data
T2080NSE8TTB NXP Semiconductors
Buy Now Datasheet
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T2080NSE8TTB NXP Semiconductors SoC, CMOS, PBGA896
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description FCBGA-896
Reach Compliance Code compliant
Factory Lead Time 18 Weeks
Samacsys Manufacturer NXP
JESD-30 Code S-PBGA-B896
Length 25 mm
Moisture Sensitivity Level 3
Number of Terminals 896
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA896,30X30,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 250
Seated Height-Max 2.61 mm
Supply Voltage-Max 1.055 V
Supply Voltage-Min 0.995 V
Supply Voltage-Nom 1.025 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 25 mm
uPs/uCs/Peripheral ICs Type SoC

T2080NSE8TTB Frequently Asked Questions (FAQ)

  • The recommended thermal design for the T2080NSE8TTB involves using a heat sink with a thermal interface material (TIM) and ensuring good airflow around the device. The datasheet provides thermal resistance values and thermal design guidelines, but it's recommended to consult with NXP's thermal design application notes and thermal simulation tools for more detailed guidance.

  • To optimize power consumption, engineers can use the device's power management features, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, optimizing the system design, using low-power modes, and minimizing idle time can also help reduce power consumption. NXP provides power estimation tools and application notes to help with power optimization.

  • The recommended PCB layout guidelines for the T2080NSE8TTB include using a 4-layer or 6-layer PCB, following NXP's recommended pinout and signal routing guidelines, and ensuring good signal integrity and power integrity. It's also important to follow NXP's guidelines for decoupling capacitors, voltage regulators, and thermal design. Consult NXP's PCB layout guidelines and application notes for more detailed information.

  • To ensure reliable booting and firmware loading, engineers should follow NXP's guidelines for boot mode configuration, firmware loading, and boot loader implementation. This includes using a reliable boot loader, configuring the boot mode correctly, and ensuring that the firmware is correctly formatted and loaded. NXP provides application notes and software development kits (SDKs) to help with booting and firmware loading.

  • Common pitfalls to avoid when designing with the T2080NSE8TTB include not following NXP's recommended design guidelines, not properly decoupling the power supply, not using adequate thermal design, and not properly configuring the device's clocking and reset signals. Additionally, not testing the design thoroughly and not following NXP's recommended testing and validation procedures can also lead to design failures.