Part Details for T1024NSE7KNPA by NXP Semiconductors
Overview of T1024NSE7KNPA by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for T1024NSE7KNPA
| Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock, ship today | 1496 |
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$42.0300 | RFQ |
Part Details for T1024NSE7KNPA
T1024NSE7KNPA CAD Models
T1024NSE7KNPA Part Data Attributes:
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T1024NSE7KNPA
NXP Semiconductors
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Datasheet
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T1024NSE7KNPA
NXP Semiconductors
RISC Microprocessor, 64-Bit, CMOS, PBGA780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 64 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 1000 MHz | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B780 | |
| JESD-609 Code | e1 | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 780 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |