Part Details for T1014ME3MQA by Teledyne e2v
Overview of T1014ME3MQA by Teledyne e2v
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Audio and Video Systems
Price & Stock for T1014ME3MQA
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
V37:1799_23838115
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Arrow Electronics | T1014ME3MQA Min Qty: 25 Package Multiple: 25 Lead time: 13 Weeks Date Code: 2313 | Americas - 100 |
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$634.0274 | Buy Now |
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DISTI #
73544223
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Verical | T1014ME3MQA Min Qty: 25 Package Multiple: 25 Date Code: 2313 | Americas - 100 |
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$634.0274 | Buy Now |
|
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Flip Electronics | Stock | 100 |
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RFQ |
Part Details for T1014ME3MQA
T1014ME3MQA CAD Models
T1014ME3MQA Part Data Attributes
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T1014ME3MQA
Teledyne e2v
Buy Now
Datasheet
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Compare Parts:
T1014ME3MQA
Teledyne e2v
RISC Microprocessor,
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Date Of Intro | 2018-07-11 | |
| JESD-30 Code | S-PBGA-B780 | |
| Length | 23 mm | |
| Number of Terminals | 780 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFBGA | |
| Package Equivalence Code | BGA780,28X28,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | |
| Seated Height-Max | 2.07 mm | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |