Part Details for STR712FR0H6 by STMicroelectronics
Overview of STR712FR0H6 by STMicroelectronics
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Part Details for STR712FR0H6
STR712FR0H6 CAD Models
STR712FR0H6 Part Data Attributes:
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STR712FR0H6
STMicroelectronics
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STR712FR0H6
STMicroelectronics
ARM-Based Flash microcontrollers with CAN
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | BGA | |
| Package Description | 8 X 8 MM, 1.70 MM HEIGHT, LFBGA-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | ARM7 | |
| Clock Frequency-Max | 16.5 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 32 | |
| Number of Terminals | 64 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA64,8X8,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 16384 | |
| ROM (words) | 65536 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.7 mm | |
| Speed | 66 MHz | |
| Supply Current-Max | 100 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 8 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |