Datasheets
STR711FR1H6 by: STMicroelectronics

ARM7TDMI™ 16/32-BIT MCU WITH FLASH, USB, CAN, 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES

Part Details for STR711FR1H6 by STMicroelectronics

Results Overview of STR711FR1H6 by STMicroelectronics

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Industrial Automation Healthcare Renewable Energy Robotics and Drones

STR711FR1H6 Information

STR711FR1H6 by STMicroelectronics is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for STR711FR1H6

STR711FR1H6 CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

STR711FR1H6 Part Data Attributes

STR711FR1H6 STMicroelectronics
Buy Now Datasheet
Compare Parts:
STR711FR1H6 STMicroelectronics ARM7TDMI™ 16/32-BIT MCU WITH FLASH, USB, CAN, 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES
Select a part to compare:
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code BGA
Package Description 8 X 8 MM, 1.70 MM HEIGHT, LFBGA-64
Pin Count 64
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Has ADC YES
Address Bus Width
Bit Size 32
Boundary Scan NO
CPU Family ARM7
Clock Frequency-Max 16.5 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code S-PBGA-B64
JESD-609 Code e1
Length 8 mm
Moisture Sensitivity Level 3
Number of I/O Lines 30
Number of Terminals 64
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA64,8X8,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 32768
ROM (words) 147456
ROM Programmability FLASH
Seated Height-Max 1.7 mm
Speed 66 MHz
Supply Current-Max 100 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 8 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC