Part Details for STP2220ABGA-100 by Sun Microsystems Inc
Overview of STP2220ABGA-100 by Sun Microsystems Inc
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Applications
Energy and Power Systems
Medical Imaging
Robotics and Drones
Part Details for STP2220ABGA-100
STP2220ABGA-100 CAD Models
STP2220ABGA-100 Part Data Attributes
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STP2220ABGA-100
Sun Microsystems Inc
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Datasheet
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STP2220ABGA-100
Sun Microsystems Inc
Microprocessor Circuit, CMOS, PBGA327, BGA-327
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SUN MICROSYSTEMS INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA372,20X20 | |
| Pin Count | 327 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| JESD-30 Code | S-PBGA-B327 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Number of Terminals | 327 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA372,20X20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.68 mm | |
| Supply Voltage-Max | 3.45 V | |
| Supply Voltage-Min | 3.15 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |