Part Details for STHVDAC-253MF3 by STMicroelectronics
Overview of STHVDAC-253MF3 by STMicroelectronics
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Price & Stock for STHVDAC-253MF3
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
55X3477
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Newark | 16/32-Bits Micros |Stmicroelectronics STHVDAC-253MF3 Min Qty: 5000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$0.6030 / $0.6080 | Buy Now |
|
DISTI #
V72:2272_17625000
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Arrow Electronics | DAC 3-CH 7-bit 16-Pin Flip-Chip T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 15 Weeks Date Code: 1746 Container: Cut Strips | Americas - 8888 |
|
$0.0685 / $0.0789 | Buy Now |
|
DISTI #
25926462
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Verical | DAC 3-CH 7-bit 16-Pin Flip-Chip T/R RoHS: Compliant Min Qty: 86 Package Multiple: 1 Date Code: 1746 | Americas - 8888 |
|
$0.0685 / $0.0755 | Buy Now |
|
DISTI #
STHVDAC-253MF3
|
Avnet Silica | DAC 3-CH 7-bit 16-Pin Flip-Chip T/R (Alt: STHVDAC-253MF3) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 17 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
DISTI #
STHVDAC-253MF3
|
EBV Elektronik | DAC 3-CH 7-bit 16-Pin Flip-Chip T/R (Alt: STHVDAC-253MF3) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 53 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for STHVDAC-253MF3
STHVDAC-253MF3 CAD Models
STHVDAC-253MF3 Part Data Attributes
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STHVDAC-253MF3
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
STHVDAC-253MF3
STMicroelectronics
BST Controller
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| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Package Description | VFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | STMicroelectronics | |
| JESD-30 Code | R-PBGA-B16 | |
| Length | 1.7 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.655 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 1.6 mm |