Datasheets
STHVDAC-253MF3 by: STMicroelectronics

BST Controller

Part Details for STHVDAC-253MF3 by STMicroelectronics

Results Overview of STHVDAC-253MF3 by STMicroelectronics

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

STHVDAC-253MF3 Information

STHVDAC-253MF3 by STMicroelectronics is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for STHVDAC-253MF3

Part # Distributor Description Stock Price Buy
DISTI # 25926462
Verical DAC 3-CH 7-bit 16-Pin Flip-Chip T/R RoHS: Compliant Min Qty: 86 Package Multiple: 1 Date Code: 1746 Americas - 8887
  • 86 $0.0727
  • 100 $0.0716
  • 250 $0.0705
  • 500 $0.0694
  • 1,000 $0.0682
  • 3,000 $0.0671
  • 6,000 $0.0660
$0.0660 / $0.0727 Buy Now
DISTI # STHVDAC-253MF3
Avnet Silica DAC 3-CH 7-bit 16-Pin Flip-Chip T/R (Alt: STHVDAC-253MF3) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 17 Weeks, 0 Days Silica - 0
Buy Now
DISTI # STHVDAC-253MF3
EBV Elektronik DAC 3-CH 7-bit 16-Pin Flip-Chip T/R (Alt: STHVDAC-253MF3) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 53 Weeks, 0 Days EBV - 0
Buy Now

Part Details for STHVDAC-253MF3

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STHVDAC-253MF3 Part Data Attributes

STHVDAC-253MF3 STMicroelectronics
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Package Description ROHS COMPLIANT, PLASTIC, WLCSP-16
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
JESD-30 Code R-PBGA-B16
Length 1.7 mm
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 0.655 mm
Supply Voltage-Nom 3.3 V
Surface Mount YES
Telecom IC Type TELECOM CIRCUIT
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.4 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.6 mm

STHVDAC-253MF3 Related Parts

STHVDAC-253MF3 Frequently Asked Questions (FAQ)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.

  • The STHVDAC-253MF3 has a complex configuration process. It's recommended to use the STMicroelectronics' graphical user interface (GUI) tool, DAC-Config, to simplify the configuration process and generate the required register settings for your specific application.

  • The maximum output current of the STHVDAC-253MF3 is 25 mA per channel, but this can be limited by the output impedance and the load connected to the device. It's essential to consider the output current requirements and ensure the device can drive the load without compromising performance.

  • The STHVDAC-253MF3 requires calibration to ensure accurate output. The device has a built-in calibration mechanism, and STMicroelectronics provides a calibration procedure in the datasheet and application notes. It's essential to follow the recommended calibration procedure to achieve optimal performance.

  • The STHVDAC-253MF3 has a high power dissipation, and proper thermal management is crucial to ensure reliable operation. STMicroelectronics recommends using a heat sink, thermal vias, and a thermal pad to dissipate heat and maintain a safe junction temperature.