Part Details for STHVDAC-253MF3 by STMicroelectronics
Results Overview of STHVDAC-253MF3 by STMicroelectronics
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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STHVDAC-253MF3 Information
STHVDAC-253MF3 by STMicroelectronics is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for STHVDAC-253MF3
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
25926462
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Verical | DAC 3-CH 7-bit 16-Pin Flip-Chip T/R RoHS: Compliant Min Qty: 86 Package Multiple: 1 Date Code: 1746 | Americas - 8887 |
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$0.0660 / $0.0727 | Buy Now |
DISTI #
STHVDAC-253MF3
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Avnet Silica | DAC 3-CH 7-bit 16-Pin Flip-Chip T/R (Alt: STHVDAC-253MF3) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
STHVDAC-253MF3
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EBV Elektronik | DAC 3-CH 7-bit 16-Pin Flip-Chip T/R (Alt: STHVDAC-253MF3) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 53 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for STHVDAC-253MF3
STHVDAC-253MF3 CAD Models
STHVDAC-253MF3 Part Data Attributes
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STHVDAC-253MF3
STMicroelectronics
Buy Now
Datasheet
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Package Description | ROHS COMPLIANT, PLASTIC, WLCSP-16 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | STMicroelectronics | |
JESD-30 Code | R-PBGA-B16 | |
Length | 1.7 mm | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -30 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 0.655 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.4 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 1.6 mm |