Datasheets
STGD3NB60SDT4 by: STMicroelectronics

N-channel 3 A, 600 V low drop IGBT

Part Details for STGD3NB60SDT4 by STMicroelectronics

Results Overview of STGD3NB60SDT4 by STMicroelectronics

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Applications Consumer Electronics Energy and Power Systems Renewable Energy

STGD3NB60SDT4 Information

STGD3NB60SDT4 by STMicroelectronics is an IGBT.
IGBTs are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for STGD3NB60SDT4

Part # Distributor Description Stock Price Buy
DISTI # 497-4109-1-ND
DigiKey IGBT 600V 6A DPAK Min Qty: 1 Lead time: 14 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) 3747
In Stock
  • 1 $1.5300
  • 10 $0.9660
  • 100 $0.6431
  • 500 $0.5046
  • 1,000 $0.4601
  • 2,500 $0.4119
  • 5,000 $0.3821
  • 7,500 $0.3669
  • 12,500 $0.3618
$0.3618 / $1.5300 Buy Now
DISTI # STGD3NB60SDT4
Avnet Americas Trans IGBT Chip N-CH 600V 6A 3-Pin(2+Tab) DPAK T/R - Tape and Reel (Alt: STGD3NB60SDT4) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 14 Weeks, 0 Days Container: Reel 0
  • 2,500 $0.4445
  • 5,000 $0.4423
  • 10,000 $0.3573
  • 15,000 $0.3508
  • 20,000 $0.3445
$0.3445 / $0.4445 Buy Now
DISTI # 511-STGD3NB60SD
Mouser Electronics IGBTs N-Ch 600 Volt 3 Amp RoHS: Compliant 7500
  • 1 $1.5100
  • 10 $0.9530
  • 100 $0.6310
  • 500 $0.4980
  • 1,000 $0.4540
  • 2,500 $0.4060
  • 5,000 $0.3750
  • 10,000 $0.3610
$0.3610 / $1.5100 Buy Now
Future Electronics STGD3NB60SD Series 600 V 3 A Surface Mount N-Channel PowerMESH™ IGBT - DPAK-3 RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 14 Weeks Container: Reel 0
Reel
  • 2,500 $0.3650
  • 5,000 $0.3600
  • 10,000 $0.3550
$0.3550 / $0.3650 Buy Now
Future Electronics STGD3NB60SD Series 600 V 3 A Surface Mount N-Channel PowerMESH™ IGBT - DPAK-3 RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 14 Weeks Container: Reel 0
Reel
  • 2,500 $0.3650
  • 5,000 $0.3600
  • 10,000 $0.3550
$0.3550 / $0.3650 Buy Now
Future Electronics STGD3NB60SD Series 600 V 3 A Surface Mount N-Channel PowerMESH™ IGBT - DPAK-3 RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 14 Weeks Container: Reel 0
Reel
  • 2,500 $0.3550
  • 5,000 $0.3500
  • 10,000 $0.3450
$0.3450 / $0.3550 Buy Now
Bristol Electronics   1500
RFQ
DISTI # STGD3NB60SDT4
TME Transistor: IGBT, 600V, 3A, 48W, DPAK Min Qty: 1 0
  • 1 $0.8480
  • 5 $0.7640
  • 25 $0.7080
  • 100 $0.6750
  • 500 $0.6060
  • 2,500 $0.5660
  • 5,000 $0.5250
  • 10,000 $0.5060
$0.5060 / $0.8480 RFQ
DISTI # STGD3NB60SDT4
Avnet Silica Trans IGBT Chip N-CH 600V 6A 3-Pin(2+Tab) DPAK T/R (Alt: STGD3NB60SDT4) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 26 Weeks, 0 Days Silica - 0
Buy Now
DISTI # STGD3NB60SDT4
EBV Elektronik Trans IGBT Chip N-CH 600V 6A 3-Pin(2+Tab) DPAK T/R (Alt: STGD3NB60SDT4) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 41 Weeks, 0 Days EBV - 0
Buy Now

Part Details for STGD3NB60SDT4

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STGD3NB60SDT4 Part Data Attributes

STGD3NB60SDT4 STMicroelectronics
Buy Now Datasheet
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STGD3NB60SDT4 STMicroelectronics N-channel 3 A, 600 V low drop IGBT
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer STMICROELECTRONICS
Part Package Code TO-252
Package Description DPAK-3
Pin Count 3
Reach Compliance Code not_compliant
ECCN Code EAR99
Factory Lead Time 14 Weeks
Samacsys Manufacturer STMicroelectronics
Collector Current-Max (IC) 6 A
Collector-Emitter Voltage-Max 600 V
Configuration SINGLE WITH BUILT-IN DIODE
Gate-Emitter Thr Voltage-Max 4.5 V
Gate-Emitter Voltage-Max 20 V
JEDEC-95 Code TO-252
JESD-30 Code R-PSSO-G2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 48 W
Qualification Status Not Qualified
Surface Mount YES
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form GULL WING
Terminal Position SINGLE
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application POWER CONTROL
Transistor Element Material SILICON
Turn-off Time-Nom (toff) 4800 ns
Turn-on Time-Nom (ton) 275 ns

Alternate Parts for STGD3NB60SDT4

This table gives cross-reference parts and alternative options found for STGD3NB60SDT4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of STGD3NB60SDT4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
STGD3NB60SD STMicroelectronics Check for Price 6A, 600V, N-CHANNEL IGBT, TO-252, DPAK-3 STGD3NB60SDT4 vs STGD3NB60SD

STGD3NB60SDT4 Related Parts

STGD3NB60SDT4 Frequently Asked Questions (FAQ)

  • The maximum junction temperature that the STGD3NB60SDT4 can withstand is 175°C.

  • To ensure reliability, it's essential to follow the recommended thermal management guidelines, such as using a heat sink, and ensuring good airflow around the device.

  • The recommended gate resistor value for the STGD3NB60SDT4 is between 10 ohms and 100 ohms, depending on the specific application and switching frequency.

  • Yes, the STGD3NB60SDT4 can be used in a parallel configuration to increase current handling, but it's essential to ensure that the devices are properly matched and that the thermal management is adequate.

  • To protect the STGD3NB60SDT4 from ESD, it's essential to follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats, and ensuring that the device is properly grounded during assembly.