Datasheets
STE70NM50 by: STMicroelectronics

N-Channel 500V - 0.045 Ohm - 70A - ISOTOP Zener-Protected MDmesh MOSFET

Part Details for STE70NM50 by STMicroelectronics

Results Overview of STE70NM50 by STMicroelectronics

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STE70NM50 Information

STE70NM50 by STMicroelectronics is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for STE70NM50

Part # Distributor Description Stock Price Buy
Bristol Electronics   9
RFQ
Quest Components   7
  • 1 $40.6560
  • 7 $38.6232
$38.6232 / $40.6560 Buy Now
Quest Components   6
  • 1 $62.6850
  • 5 $59.5508
$59.5508 / $62.6850 Buy Now
ComSIT USA 500 V, 70 A, 0.045 OHM ISOTOP N CHANNEL ZENER, PROTECTED MDMESHPOWER MOSFET Power Field-Effect Trans... istor, 70A I(D), 500V, 0.05ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET more ECCN: EAR99 RoHS: Compliant Stock DE - 20
Stock ES - 0
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ
DISTI # STE70NM50
Avnet Silica Trans MOSFET NCH 500V 70A 4Pin ISOTOP Tube (Alt: STE70NM50) RoHS: Compliant Min Qty: 10 Package Multiple: 10 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now
Vyrian Transistors 241
RFQ

Part Details for STE70NM50

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STE70NM50 Part Data Attributes

STE70NM50 STMicroelectronics
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STE70NM50 STMicroelectronics N-Channel 500V - 0.045 Ohm - 70A - ISOTOP Zener-Protected MDmesh MOSFET
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code ISOTOP
Package Description ISOTOP-4
Pin Count 4
Manufacturer Package Code ISOTOP
Reach Compliance Code not_compliant
ECCN Code EAR99
Samacsys Manufacturer STMicroelectronics
Avalanche Energy Rating (Eas) 1400 mJ
Case Connection ISOLATED
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 500 V
Drain Current-Max (ID) 70 A
Drain-source On Resistance-Max 0.05 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PUFM-X4
Number of Elements 1
Number of Terminals 4
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 460 W
Pulsed Drain Current-Max (IDM) 280 A
Qualification Status Not Qualified
Surface Mount NO
Terminal Form UNSPECIFIED
Terminal Position UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Application SWITCHING
Transistor Element Material SILICON

Alternate Parts for STE70NM50

This table gives cross-reference parts and alternative options found for STE70NM50. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of STE70NM50, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
STN2NE10 STMicroelectronics Check for Price 2A, 100V, 0.4ohm, N-CHANNEL, Si, POWER, MOSFET, SOT-223, 4 PIN STE70NM50 vs STN2NE10
FDT457N onsemi Check for Price N-Channel Enhancement Mode Field Effect Transistor 30V, 5A, 60mΩ, SOT-223-4 / TO-261-4, 4000-REEL STE70NM50 vs FDT457N
STE36N50 STMicroelectronics Check for Price 36A, 500V, 0.14ohm, N-CHANNEL, Si, POWER, MOSFET, POWER, ISOTOP-4 STE70NM50 vs STE36N50
STE45N50 STMicroelectronics Check for Price 0.11ohm, Si, POWER, FET, POWER, ISOTOP-4 STE70NM50 vs STE45N50
FDT457N Fairchild Semiconductor Corporation Check for Price N-Channel Enhancement Mode Field Effect Transistor, MOLDED PACKAGE, SOT-223, 4 LEAD, 4000/TAPE REEL STE70NM50 vs FDT457N
STE36N50-DK STMicroelectronics Check for Price 36A, 500V, 0.14ohm, N-CHANNEL, Si, POWER, MOSFET, POWER, ISOTOP-4 STE70NM50 vs STE36N50-DK
STN4NF03L STMicroelectronics $0.4305 N-Channel 30V - 0.039 Ohm - 4A - SOT-223 STripFET(TM) POWER MOSFET STE70NM50 vs STN4NF03L
STN4NF06L STMicroelectronics $0.5375 Automotive-grade N-channel 60 V, 0.07 Ohm typ., 4 A STripFET II Power MOSFET in SOT-223 package STE70NM50 vs STN4NF06L
FDT459N_NL Fairchild Semiconductor Corporation Check for Price Power Field-Effect Transistor, 6.5A I(D), 30V, 0.035ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET STE70NM50 vs FDT459N_NL
STE36N50A STMicroelectronics Check for Price 36A, 500V, 0.14ohm, N-CHANNEL, Si, POWER, MOSFET, POWER, ISOTOP-4 STE70NM50 vs STE36N50A

STE70NM50 Related Parts

STE70NM50 Frequently Asked Questions (FAQ)

  • STMicroelectronics provides a recommended PCB layout for the STE70NM50 in their application note AN5046, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.

  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal interface materials, such as thermal pads or thermal grease, to improve heat transfer between the device and the heat sink.

  • The STE70NM50's high current handling requires careful PCB design consideration to prevent overheating, voltage drops, and electromagnetic interference (EMI). Ensure that the PCB traces are wide enough to handle the high currents, and consider using multiple layers or thick copper to reduce resistance and inductance.

  • When selecting a heat sink for the STE70NM50, consider the device's power dissipation, ambient temperature, and airflow. A heat sink with a high thermal conductivity, such as copper or aluminum, and a large surface area is recommended. Additionally, ensure that the heat sink is properly attached to the device using a suitable thermal interface material.

  • The STE70NM50 is a high-power device that can generate significant electromagnetic interference (EMI). To minimize EMI, use proper PCB layout techniques, such as separating high-current and low-current paths, using shielding, and adding EMI filters or chokes as needed. Additionally, ensure that the device is properly grounded and that the PCB is designed to minimize radiation.