Part Details for STA330 by STMicroelectronics
Overview of STA330 by STMicroelectronics
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Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Part Details for STA330
STA330 CAD Models
STA330 Part Data Attributes
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STA330
STMicroelectronics
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STA330
STMicroelectronics
SPECIALTY CONSUMER CIRCUIT, QCC52, LEAD FREE, VFQFPN-52
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | QFN | |
| Package Description | LEAD FREE, VFQFPN-52 | |
| Pin Count | 52 | |
| Manufacturer Package Code | VFQFPN | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Consumer IC Type | CONSUMER CIRCUIT | |
| JESD-30 Code | S-XQCC-N52 | |
| JESD-609 Code | e3 | |
| Length | 8 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 52 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC52,.31SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 8 mm |