Part Details for ST62T30BB6 by STMicroelectronics
Results Overview of ST62T30BB6 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
ST62T30BB6 Information
ST62T30BB6 by STMicroelectronics is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for ST62T30BB6
ST62T30BB6 CAD Models
ST62T30BB6 Part Data Attributes
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ST62T30BB6
STMicroelectronics
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Datasheet
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ST62T30BB6
STMicroelectronics
8-BIT, OTPROM, 8MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | 0.600 INCH, PLASTIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Has ADC | YES | |
| Additional Feature | ALSO OPERATES AT 3 V MINIMUM SUPPLY | |
| Address Bus Width | ||
| Bit Size | 8 | |
| CPU Family | ST6200 | |
| Clock Frequency-Max | 8 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | R-PDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.4 mm | |
| Number of I/O Lines | 20 | |
| Number of Terminals | 28 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 192 | |
| ROM (words) | 7948 | |
| ROM Programmability | OTPROM | |
| Seated Height-Max | 6.35 mm | |
| Speed | 8 MHz | |
| Supply Current-Max | 7 mA | |
| Supply Voltage-Max | 6 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 4.5 V | |
| Surface Mount | NO | |
| Technology | HCMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Alternate Parts for ST62T30BB6
This table gives cross-reference parts and alternative options found for ST62T30BB6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ST62T30BB6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| ST62T30BB3 | STMicroelectronics | Check for Price | 8-BIT, OTPROM, 4MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | ST62T30BB6 vs ST62T30BB3 |
ST62T30BB6 Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
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To ensure reliable communication, use a differential signaling scheme, such as RS-485, and implement proper noise filtering and shielding techniques. Additionally, consider using a common-mode choke and a shielded cable to reduce electromagnetic interference (EMI).
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When powering the ST62T30BB6 from a battery, consider the battery's voltage range, self-discharge rate, and capacity. Use a low-dropout regulator (LDO) to regulate the voltage supply, and implement a power-saving strategy, such as a low-power mode or sleep mode, to minimize power consumption.
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To troubleshoot issues with the serial communication interface, use a logic analyzer or an oscilloscope to monitor the signal lines. Check the baud rate, data bits, parity, and stop bits for correct configuration. Verify that the transmitter and receiver are properly connected and that there are no signal integrity issues.
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In high-temperature environments, ensure good airflow around the device, and consider using a heat sink or a thermal interface material (TIM) to improve heat dissipation. Monitor the device's junction temperature and implement thermal throttling or shutdown mechanisms to prevent overheating.