Datasheets
ST33HTPH2E32AHC2 by: STMicroelectronics

Trusted Platform Module 1.2 &amp; 2.0 with TCG I<sup>2</sup>C interface

Part Details for ST33HTPH2E32AHC2 by STMicroelectronics

Results Overview of ST33HTPH2E32AHC2 by STMicroelectronics

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Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Smart Cities Renewable Energy Robotics and Drones

ST33HTPH2E32AHC2 Information

ST33HTPH2E32AHC2 by STMicroelectronics is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for ST33HTPH2E32AHC2

Part # Distributor Description Stock Price Buy
DISTI # ST33HTPH2E32AHC2
Avnet Silica Flash memory based device combining TPM 12 and TPM 20 with highspeed SPI interface (Alt: ST33HTPH2E3... 2AHC2) more RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 17 Weeks, 0 Days Silica - 0
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DISTI # ST33HTPH2E32AHC2
EBV Elektronik Flash memory based device combining TPM 12 and TPM 20 with highspeed SPI interface (Alt: ST33HTPH2E3... 2AHC2) more RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 21 Weeks, 0 Days EBV - 0
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Part Details for ST33HTPH2E32AHC2

ST33HTPH2E32AHC2 CAD Models

ST33HTPH2E32AHC2 Part Data Attributes

ST33HTPH2E32AHC2 STMicroelectronics
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ST33HTPH2E32AHC2 STMicroelectronics Trusted Platform Module 1.2 &amp; 2.0 with TCG I<sup>2</sup>C interface
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Part Life Cycle Code Not Recommended
Ihs Manufacturer STMICROELECTRONICS
Package Description ,
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.31.00.01
Samacsys Manufacturer STMicroelectronics
Additional Feature ALSO OPERATES AT 3.3V NOMINAL VOLATGE
JESD-30 Code S-XQCC-N32
Length 5 mm
Number of Terminals 32
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC32,.2SQ,20
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1 mm
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5 mm
uPs/uCs/Peripheral ICs Type CRYPTOGRAPHIC AUTHENTICATOR

Alternate Parts for ST33HTPH2E32AHC2

This table gives cross-reference parts and alternative options found for ST33HTPH2E32AHC2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ST33HTPH2E32AHC2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

ST33HTPH2E32AHC2 Frequently Asked Questions (FAQ)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5024, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).

  • STMicroelectronics provides a secure boot implementation guide in the application note AN5156, which details the steps to implement secure boot using the ST33HTPH2E32AHC2's built-in secure boot mechanism and the STM32CubeProgrammer software.

  • The ST33HTPH2E32AHC2's cryptographic accelerators have limitations on key sizes, algorithm support, and throughput. For example, the AES accelerator only supports up to 256-bit keys, and the RSA accelerator has limitations on key sizes and signature schemes. Refer to the datasheet and application notes for detailed information on the cryptographic accelerator limitations.

  • STMicroelectronics provides a comprehensive guide on integrating the ST33HTPH2E32AHC2 with an STM32 microcontroller in the application note AN5129, which covers the hardware and software aspects of the integration, including communication protocols and firmware development.

  • The ST33HTPH2E32AHC2 has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinking, thermal pads, and PCB design considerations. Refer to the datasheet and application notes for thermal management guidelines.