Datasheets
ST20196 by: STMicroelectronics

SPECIALTY TELECOM CIRCUIT, PBGA208, 17 X 17 MM, 1.70 MM HEIGHT, LBGA-208

Part Details for ST20196 by STMicroelectronics

Overview of ST20196 by STMicroelectronics

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for ST20196

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ST20196 Part Data Attributes

ST20196 STMicroelectronics
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ST20196 STMicroelectronics SPECIALTY TELECOM CIRCUIT, PBGA208, 17 X 17 MM, 1.70 MM HEIGHT, LBGA-208
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code BGA
Package Description 17 X 17 MM, 1.70 MM HEIGHT, LBGA-208
Pin Count 208
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Data Rate 24000 Mbps
JESD-30 Code S-PBGA-B208
JESD-609 Code e1
Length 17 mm
Number of Functions 1
Number of Terminals 208
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA208,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Telecom IC Type TELECOM CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm

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