Part Details for ST20196 by STMicroelectronics
Overview of ST20196 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for ST20196
ST20196 CAD Models
ST20196 Part Data Attributes
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ST20196
STMicroelectronics
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Datasheet
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ST20196
STMicroelectronics
SPECIALTY TELECOM CIRCUIT, PBGA208, 17 X 17 MM, 1.70 MM HEIGHT, LBGA-208
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1.70 MM HEIGHT, LBGA-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Data Rate | 24000 Mbps | |
| JESD-30 Code | S-PBGA-B208 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 208 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA208,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm |